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util/bincfg: Add DDR4 SPD spec 

Additionally provide a simple script for decoding spd hex files using bincfg.

BUG=b:148561711
TEST=Decoded spd files in zork
BRANCH=None

Change-Id: Ic62868d59e075fd6816d7be55cc935e3e3f82499
Signed-off-by: Rob Barnes <robbarnes@google.com>
Reviewed-on: https://chromium-review.googlesource.com/2067697
Reviewed-by: Martin Roth <martinroth@google.com>
Reviewed-by: Paul Fagerburg <pfagerburg@chromium.org>
Reviewed-on: https://review.coreboot.org/c/coreboot/+/39621
Tested-by: build bot (Jenkins) <no-reply@coreboot.org>
Reviewed-by: Michael Niewöhner
This commit is contained in:
Rob Barnes 2020-02-20 14:35:51 -07:00 committed by Felix Held
parent 9d49598cd6
commit 5baadba532
4 changed files with 775 additions and 0 deletions
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362
util/bincfg/ddr4_registered_spd_512.spec Normal file
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# 4_01_02_AnnexL-R25_SPD_for_DDR4_SDRAM_Release_3_Sep2015.pdf
#
# JEDEC Standard No. 21-C
# Page 4.1.2.12.3 – 1
# Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules
# DDR4 SPD Document Release 3
# UDIMM Revision 1.1
# RDIMM Revision 1.1
# LRDIMM Revision 1.1
# NVDIMM Revision 1.0
{
# Byte 0: Number of Bytes Used / Number of Bytes in SPD Device /
# CRC Coverage
"SPD_Bytes_Used" : 4,
"SPD_Bytes_Total" : 3,
"CRC_Coverage" : 1,
# Byte 1: SPD Revision
"SPD_Revision" : 8,
# Byte 2: Key Byte / DRAM Device Type
"DRAM_Device_Type" : 8,
# Byte 3: Key Byte / Module Type
"Base_Module_Type" : 4,
"Hybrid_Media" : 3,
"Is_Hybrid" : 1,
# Byte 4: SDRAM Density and Banks
"SDRAM_Capacity" : 4,
"Bank_Address_Bits" : 2,
"Bank_Group_Bits" : 2,
# Byte 5: SDRAM Addressing
"Column_Address_Bits" : 3,
"Row_Address_Bits" : 3,
"Byte_5_reserved" : 2,
# Byte 6: SDRAM Package Type
"Signal_Loading" : 2,
"Byte_6_reserved" : 2,
"Die_Count" : 3,
"SDRAM_Package_Type" : 1,
# Byte 7: SDRAM Optional Features
"Maximum_Activate_Count" : 4,
"Maximum_Activate_Window" : 2,
"Byte_7_reserved" : 2,
# Byte 8: SDRAM Thermal and Refresh Options
"Byte_8_reserved" : 8,
# Byte 9: Other SDRAM Optional Features
"Byte_9_reserved" : 5,
"Soft_PPR" : 1,
"Post_Package_Repair" : 2,
# Byte 10: Secondary SDRAM Package Type
"Secondary_Signal_Loading" : 2,
"Secondary_DRAM_Densityt_Ratio" : 2,
"Secondary_Die_Count" : 3,
"Secondary_SDRAM_Package_Type" : 1,
# Byte 11: Module Nominal Voltage, VDD
"DRAM_VDD_1_2_V" : 2,
"Byte_11_reserved" : 6,
# Byte 12: Module Organization
"SDRAM_Device_Width" : 3,
"Number_of_Package_Ranks_per_DIMM" : 3,
"Rank_Mix" : 1,
"Byte_12_reserved" : 1,
# Byte 13: Module Memory Bus Width
"Primary_bus_width_in_bits" : 3,
"Bus_width_extension_in_bits" : 2,
"Byte_13_reserved" : 3,
# Byte 14: Module Thermal Sensor
"Byte_14_reserved" : 7,
"Thermal_Sensor" : 1,
# Byte 15: Extended Module Type
"Extended_Base_Module_Type" : 4,
"Byte_15_reserved" : 4,
# Byte 16: Reserved
"Byte_16_reserved" : 8,
# Byte 17: Timebases
"Fine_Timebase" : 2,
"Medium_Timebase" : 2,
"Byte_17_reserved" : 4,
# Byte 18: SDRAM Minimum Cycle Time (tCKAVGmin)
"tCKAVGmin" : 8,
# Byte 19: SDRAM Maximum Cycle Time (tCKAVGmax)
"tCKAVGmax" : 8,
# Bytes 20 - 23: CAS Latencies Supported
"CL_7_Supported" : 1,
"CL_8_Supported" : 1,
"CL_9_Supported" : 1,
"CL_10_Supported" : 1,
"CL_11_Supported" : 1,
"CL_12_Supported" : 1,
"CL_13_Supported" : 1,
"CL_14_Supported" : 1,
"CL_15_Supported" : 1,
"CL_16_Supported" : 1,
"CL_17_Supported" : 1,
"CL_18_Supported" : 1,
"CL_19_Supported" : 1,
"CL_20_Supported" : 1,
"CL_21_Supported" : 1,
"CL_22_Supported" : 1,
"CL_23_Supported" : 1,
"CL_24_Supported" : 1,
"CL_25_Supported" : 1,
"CL_26_Supported" : 1,
"CL_27_Supported" : 1,
"CL_28_Supported" : 1,
"CL_29_Supported" : 1,
"CL_30_Supported" : 1,
"CL_31_Supported" : 1,
"CL_32_Supported" : 1,
"CL_33_Supported" : 1,
"CL_34_Supported" : 1,
"CL_35_Supported" : 1,
"CL_36_Supported" : 1,
"Byte_23_reserved" : 1,
"CL_range" : 1,
# Byte 24: Minimum CAS Latency Time (tAAmin)
"tAAmin" : 8,
# Byte 25: Minimum RAS to CAS Delay Time (tRCDmin)
"tRCDmin" : 8,
# Byte 26: Minimum Row Precharge Delay Time (tRPmin)
"tRPmin" : 8,
# Bytes 27 - 29: Minimum Active to Precharge Delay Time (tRASmin)
# / Minimum Active to Active/Refresh Delay Time
# (tRCmin)
"tRASmin_MSN" : 4,
"tRCmin_MSN" : 4,
"tRASmin_LSB" : 8,
"tRCmin_LSB" : 8,
# Bytes 30 - 31: Minimum Refresh Recovery Delay Time (tRFC1min)
"tRFC1min_LSB" : 8,
"tRFC1min_MSB" : 8,
# Bytes 32 - 33: Minimum Refresh Recovery Delay Time (tRFC2min)
"tRFC2min_LSB" : 8,
"tRFC2min_MSB" : 8,
# Bytes 34 - 35: Minimum Refresh Recovery Delay Time (tRFC4min)
"tRFC4min_LSB" : 8,
"tRFC4min_MSB" : 8,
# Byte 36 - 37: Minimum Four Activate Window Delay Time
# (tFAWmin)
"tFAWmin_MSN" : 4,
"Byte_36_reserved" : 4,
"tFAWmin_LSB" : 8,
# Bytes 38: Minimum Activate to Activate Delay Time (tRRD_Smin),
# different bank group
"tRRD_Smin" : 8,
# Byte 39: Minimum Activate to Activate Delay Time (tRRD_Lmin),
# same bank group
"tRRD_Lmin" : 8,
# Byte 40: Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank
# group
"tCCD_Lmin" : 8,
# Byte 41 - 42: Minimum Write Recovery Time (tWRmin)
"tWRmin_MSN" : 4,
"Byte_41_reserved" : 4,
"tWRmin_MSB" : 8,
# Byte 43-45: Minimum Write to Read Time (tWTR_Smin),
# different bank group / Minimum Write to Read Time
# (tWTR_Lmin), same bank group
"tWTR_Smin_MSN" : 4,
"tWTR_Lmin_MSN" : 4,
"tWTR_Smin_LSB" : 8,
"tWTR_Lmin_LSB" : 8,
# Byte 46~59: Reserved, Base Configuration Section
"Byte_46_59_reserved" [14] : 8,
# Byte 60: Connector to SDRAM Bit Mapping (DQ0-3)
"DQ0_3" : 8,
# Byte 61: Connector to SDRAM Bit Mapping (DQ4-7)
"DQ4_7" : 8,
# Byte 62: Connector to SDRAM Bit Mapping (DQ8-11)
"DQ8_11" : 8,
# Byte 63: Connector to SDRAM Bit Mapping (DQ12-15)
"DQ12_15" : 8,
# Byte 64: Connector to SDRAM Bit Mapping (DQ16-19)
"DQ16_19" : 8,
# Byte 65: Connector to SDRAM Bit Mapping (DQ20-23)
"DQ20_23" : 8,
# Byte 66: Connector to SDRAM Bit Mapping (DQ24-27)
"DQ24_27" : 8,
# Byte 67: Connector to SDRAM Bit Mapping (DQ28-31)
"DQ28_31" : 8,
# Byte 68: Connector to SDRAM Bit Mapping (CB0-3)
"CB0_3" : 8,
# Byte 69: Connector to SDRAM Bit Mapping (CB4-7)
"CB4_7" : 8,
# Byte 70: Connector to SDRAM Bit Mapping (DQ32-35)
"DQ32_35" : 8,
# Byte 71: Connector to SDRAM Bit Mapping (DQ36-39)
"DQ36_39" : 8,
# Byte 72: Connector to SDRAM Bit Mapping (DQ40-43)
"DQ40_43" : 8,
# Byte 73: Connector to SDRAM Bit Mapping (DQ44-47)
"DQ44_47" : 8,
# Byte 74: Connector to SDRAM Bit Mapping (DQ48-51)
"DQ48_51" : 8,
# Byte 75: Connector to SDRAM Bit Mapping (DQ52-55)
"DQ52_55" : 8,
# Byte 76: Connector to SDRAM Bit Mapping (DQ56-59)
"DQ56_59" : 8,
# Byte 77: Connector to SDRAM Bit Mapping (DQ60-63)
"DQ60_63" : 8,
# Bytes 78~116: Reserved, Base Configuration Section
# Must be coded as 0x00
"Byte_78_116_reserved" [39] : 8,
# Byte 117: Fine Offset for Minimum CAS to CAS Delay Time
# (tCCD_Lmin), same bank group
"tCCD_Lmin" : 8,
# Byte 118: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Lmin), same bank group
"tRRD_Lmin" : 8,
# Byte 119: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Smin), different bank group
"tRRD_Smin" : 8,
# Byte 120: Fine Offset for Minimum Active to Active/Refresh
# Delay Time (tRCmin)
"tRCmin" : 8,
# Byte 121: Fine Offset for Minimum Row Precharge Delay
# Time (tRPmin)
"tRPmin" : 8,
# Byte 122: Fine Offset for Minimum RAS to CAS Delay
# Time (tRCDmin)
"tRCDmin" : 8,
# Byte 123: Fine Offset for Minimum CAS Latency Time (tAAmin)
"tAAmin" : 8,
# Byte 124: Fine Offset for SDRAM Maximum Cycle Time
# (tCKAVGmax)
"tCKAVGmax" : 8,
# Byte 125: Fine Offset for SDRAM Minimum Cycle Time
# (tCKAVGmin)
"tCKAVGmin" : 8,
# Byte 126 - 127: Cyclical Redundancy Code (CRC) for
# Base Configuration Section
"CRC_Base_Configuration" : 16,
# Standard Module Parameters - Overlay Bytes 128~191
# Module Specific Bytes for Registered Memory Module Types
# Byte 128: Raw Card Extension, Module Nominal Height
"Module_Nominal_Height_Max" : 5,
"Raw_Card_Extension" : 3,
# Byte 129: Module Maximum Thickness
"Module_Maximum_Thickness_Front" : 4,
"Module_Maximum_Thickness_Back" : 4,
# Byte 130: Reference Raw Card Used
"Reference_Raw_Card" : 5,
"Reference_Raw_Card_Revision" : 2,
"Reference_Raw_Card_Extension" : 1,
# Byte 131: DIMM Attributes
"Number_of_Registers_used_on_RDIMM" : 2,
"Number_of_DRAMS_on_RDIMM" : 2,
"Register_Type" : 4,
# Byte 132: RDIMM Thermal Heat Spreader Solution
"Heat_Spreader_Thermal_Characteristics" : 7,
"Heat_Spreader_Solution" : 1,
# Byte 133 - 134: Register Manufacturer ID Code
"Register_Manufacturer_ID_Code" : 16,
# Byte 135: Register Revision Number
"Register_Revision_Number" : 8,
# Byte 136: Address Mapping from Register to DRAM
"Rank_1_Mapping" : 1,
"Byte_136_Reserved" : 7,
# Byte 137: Register Output Drive Strength for
# Control and Command/Address
"Register_Output_Drive_CKE" : 2,
"Register_Output_Drive_ODT" : 2,
"Register_Output_Drive_Command_Address" : 2,
"Register_Output_Drive_Chip_Select" : 2,
# Byte 138: Register Output Drive Strength for Clock
"Register_Output_Drive_Strength_Clock_Y0_Y2" : 2,
"Register_Output_Drive_Strength_Clock_Y1_Y3" : 2,
"Byte_138_reserved" : 4,
# Byte 139 - 191: Reserved
"Byte_139_191" [53] : 8,
# Unused
# Byte 192 - 253: Unused
"Byte_192_255_unused" [62] : 8,
# Byte 254 - 255: CRC for SPD Block 1
"CRC_SPD_Block_1" : 16,
# Reserved
# Byte 256 - 319: Reserved
"Byte_256_319_reserved" [64] : 8,
# End User Programmable
# Byte 384 - 511
"End_User_Programmable" [128] : 8
}

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# 4_01_02_AnnexL-R25_SPD_for_DDR4_SDRAM_Release_3_Sep2015.pdf
#
# JEDEC Standard No. 21-C
# Page 4.1.2.12.3 – 1
# Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules
# DDR4 SPD Document Release 3
# UDIMM Revision 1.1
# RDIMM Revision 1.1
# LRDIMM Revision 1.1
# NVDIMM Revision 1.0
{
# Byte 0: Number of Bytes Used / Number of Bytes in SPD Device /
# CRC Coverage
"SPD_Bytes_Used" : 4,
"SPD_Bytes_Total" : 3,
"CRC_Coverage" : 1,
# Byte 1: SPD Revision
"SPD_Revision" : 8,
# Byte 2: Key Byte / DRAM Device Type
"DRAM_Device_Type" : 8,
# Byte 3: Key Byte / Module Type
"Base_Module_Type" : 4,
"Hybrid_Media" : 3,
"Is_Hybrid" : 1,
# Byte 4: SDRAM Density and Banks
"SDRAM_Capacity" : 4,
"Bank_Address_Bits" : 2,
"Bank_Group_Bits" : 2,
# Byte 5: SDRAM Addressing
"Column_Address_Bits" : 3,
"Row_Address_Bits" : 3,
"Byte_5_reserved" : 2,
# Byte 6: SDRAM Package Type
"Signal_Loading" : 2,
"Byte_6_reserved" : 2,
"Die_Count" : 3,
"SDRAM_Package_Type" : 1,
# Byte 7: SDRAM Optional Features
"Maximum_Activate_Count" : 4,
"Maximum_Activate_Window" : 2,
"Byte_7_reserved" : 2,
# Byte 8: SDRAM Thermal and Refresh Options
"Byte_8_reserved" : 8,
# Byte 9: Other SDRAM Optional Features
"Byte_9_reserved" : 5,
"Soft_PPR" : 1,
"Post_Package_Repair" : 2,
# Byte 10: Secondary SDRAM Package Type
"Secondary_Signal_Loading" : 2,
"Secondary_DRAM_Densityt_Ratio" : 2,
"Secondary_Die_Count" : 3,
"Secondary_SDRAM_Package_Type" : 1,
# Byte 11: Module Nominal Voltage, VDD
"DRAM_VDD_1_2_V" : 2,
"Byte_11_reserved" : 6,
# Byte 12: Module Organization
"SDRAM_Device_Width" : 3,
"Number_of_Package_Ranks_per_DIMM" : 3,
"Rank_Mix" : 1,
"Byte_12_reserved" : 1,
# Byte 13: Module Memory Bus Width
"Primary_bus_width_in_bits" : 3,
"Bus_width_extension_in_bits" : 2,
"Byte_13_reserved" : 3,
# Byte 14: Module Thermal Sensor
"Byte_14_reserved" : 7,
"Thermal_Sensor" : 1,
# Byte 15: Extended Module Type
"Extended_Base_Module_Type" : 4,
"Byte_15_reserved" : 4,
# Byte 16: Reserved
"Byte_16_reserved" : 8,
# Byte 17: Timebases
"Fine_Timebase" : 2,
"Medium_Timebase" : 2,
"Byte_17_reserved" : 4,
# Byte 18: SDRAM Minimum Cycle Time (tCKAVGmin)
"tCKAVGmin" : 8,
# Byte 19: SDRAM Maximum Cycle Time (tCKAVGmax)
"tCKAVGmax" : 8,
# Bytes 20 - 23: CAS Latencies Supported
"CL_7_Supported" : 1,
"CL_8_Supported" : 1,
"CL_9_Supported" : 1,
"CL_10_Supported" : 1,
"CL_11_Supported" : 1,
"CL_12_Supported" : 1,
"CL_13_Supported" : 1,
"CL_14_Supported" : 1,
"CL_15_Supported" : 1,
"CL_16_Supported" : 1,
"CL_17_Supported" : 1,
"CL_18_Supported" : 1,
"CL_19_Supported" : 1,
"CL_20_Supported" : 1,
"CL_21_Supported" : 1,
"CL_22_Supported" : 1,
"CL_23_Supported" : 1,
"CL_24_Supported" : 1,
"CL_25_Supported" : 1,
"CL_26_Supported" : 1,
"CL_27_Supported" : 1,
"CL_28_Supported" : 1,
"CL_29_Supported" : 1,
"CL_30_Supported" : 1,
"CL_31_Supported" : 1,
"CL_32_Supported" : 1,
"CL_33_Supported" : 1,
"CL_34_Supported" : 1,
"CL_35_Supported" : 1,
"CL_36_Supported" : 1,
"Byte_23_reserved" : 1,
"CL_range" : 1,
# Byte 24: Minimum CAS Latency Time (tAAmin)
"tAAmin" : 8,
# Byte 25: Minimum RAS to CAS Delay Time (tRCDmin)
"tRCDmin" : 8,
# Byte 26: Minimum Row Precharge Delay Time (tRPmin)
"tRPmin" : 8,
# Bytes 27 - 29: Minimum Active to Precharge Delay Time (tRASmin)
# / Minimum Active to Active/Refresh Delay Time
# (tRCmin)
"tRASmin_MSN" : 4,
"tRCmin_MSN" : 4,
"tRASmin_LSB" : 8,
"tRCmin_LSB" : 8,
# Bytes 30 - 31: Minimum Refresh Recovery Delay Time (tRFC1min)
"tRFC1min_LSB" : 8,
"tRFC1min_MSB" : 8,
# Bytes 32 - 33: Minimum Refresh Recovery Delay Time (tRFC2min)
"tRFC2min_LSB" : 8,
"tRFC2min_MSB" : 8,
# Bytes 34 - 35: Minimum Refresh Recovery Delay Time (tRFC4min)
"tRFC4min_LSB" : 8,
"tRFC4min_MSB" : 8,
# Byte 36 - 37: Minimum Four Activate Window Delay Time
# (tFAWmin)
"tFAWmin_MSN" : 4,
"Byte_36_reserved" : 4,
"tFAWmin_LSB" : 8,
# Bytes 38: Minimum Activate to Activate Delay Time (tRRD_Smin),
# different bank group
"tRRD_Smin" : 8,
# Byte 39: Minimum Activate to Activate Delay Time (tRRD_Lmin),
# same bank group
"tRRD_Lmin" : 8,
# Byte 40: Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank
# group
"tCCD_Lmin" : 8,
# Byte 41 - 42: Minimum Write Recovery Time (tWRmin)
"tWRmin_MSN" : 4,
"Byte_41_reserved" : 4,
"tWRmin_MSB" : 8,
# Byte 43-45: Minimum Write to Read Time (tWTR_Smin),
# different bank group / Minimum Write to Read Time
# (tWTR_Lmin), same bank group
"tWTR_Smin_MSN" : 4,
"tWTR_Lmin_MSN" : 4,
"tWTR_Smin_LSB" : 8,
"tWTR_Lmin_LSB" : 8,
# Byte 46~59: Reserved, Base Configuration Section
"Byte_46_59_reserved" [14] : 8,
# Byte 60: Connector to SDRAM Bit Mapping (DQ0-3)
"DQ0_3" : 8,
# Byte 61: Connector to SDRAM Bit Mapping (DQ4-7)
"DQ4_7" : 8,
# Byte 62: Connector to SDRAM Bit Mapping (DQ8-11)
"DQ8_11" : 8,
# Byte 63: Connector to SDRAM Bit Mapping (DQ12-15)
"DQ12_15" : 8,
# Byte 64: Connector to SDRAM Bit Mapping (DQ16-19)
"DQ16_19" : 8,
# Byte 65: Connector to SDRAM Bit Mapping (DQ20-23)
"DQ20_23" : 8,
# Byte 66: Connector to SDRAM Bit Mapping (DQ24-27)
"DQ24_27" : 8,
# Byte 67: Connector to SDRAM Bit Mapping (DQ28-31)
"DQ28_31" : 8,
# Byte 68: Connector to SDRAM Bit Mapping (CB0-3)
"CB0_3" : 8,
# Byte 69: Connector to SDRAM Bit Mapping (CB4-7)
"CB4_7" : 8,
# Byte 70: Connector to SDRAM Bit Mapping (DQ32-35)
"DQ32_35" : 8,
# Byte 71: Connector to SDRAM Bit Mapping (DQ36-39)
"DQ36_39" : 8,
# Byte 72: Connector to SDRAM Bit Mapping (DQ40-43)
"DQ40_43" : 8,
# Byte 73: Connector to SDRAM Bit Mapping (DQ44-47)
"DQ44_47" : 8,
# Byte 74: Connector to SDRAM Bit Mapping (DQ48-51)
"DQ48_51" : 8,
# Byte 75: Connector to SDRAM Bit Mapping (DQ52-55)
"DQ52_55" : 8,
# Byte 76: Connector to SDRAM Bit Mapping (DQ56-59)
"DQ56_59" : 8,
# Byte 77: Connector to SDRAM Bit Mapping (DQ60-63)
"DQ60_63" : 8,
# Bytes 78~116: Reserved, Base Configuration Section
# Must be coded as 0x00
"Byte_78_116_reserved" [39] : 8,
# Byte 117: Fine Offset for Minimum CAS to CAS Delay Time
# (tCCD_Lmin), same bank group
"tCCD_Lmin_Fine_Offset" : 8,
# Byte 118: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Lmin), same bank group
"tRRD_Lmin_Fine_Offset" : 8,
# Byte 119: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Smin), different bank group
"tRRD_Smin_Fine_Offset" : 8,
# Byte 120: Fine Offset for Minimum Active to Active/Refresh
# Delay Time (tRCmin)
"tRCmin_Fine_Offset" : 8,
# Byte 121: Fine Offset for Minimum Row Precharge Delay
# Time (tRPmin)
"tRPmin_Fine_Offset" : 8,
# Byte 122: Fine Offset for Minimum RAS to CAS Delay
# Time (tRCDmin)
"tRCDmin_Fine_Offset" : 8,
# Byte 123: Fine Offset for Minimum CAS Latency Time (tAAmin)
"tAAmin_Fine_Offset" : 8,
# Byte 124: Fine Offset for SDRAM Maximum Cycle Time
# (tCKAVGmax)
"tCKAVGmax_Fine_Offset" : 8,
# Byte 125: Fine Offset for SDRAM Minimum Cycle Time
# (tCKAVGmin)
"tCKAVGmin_Fine_Offset" : 8,
# Byte 126 - 127: Cyclical Redundancy Code (CRC) for
# Base Configuration Section
"CRC_Base_Configuration" : 16,
# Standard Module Parameters - Overlay Bytes 128~191
# Module Specific Bytes for Unbuffered Memory Module Types
# Byte 128: Raw Card Extension, Module Nominal Height
"Module_Nominal_Height_Max" : 5,
"Raw_Card_Extension" : 3,
# Byte 129: Module Maximum Thickness
"Module_Maximum_Thickness_Front" : 4,
"Module_Maximum_Thickness_Back" : 4,
# Byte 130: Reference Raw Card Used
"Reference_Raw_Card" : 5,
"Reference_Raw_Card_Revision" : 2,
"Reference_Raw_Card_Extension" : 1,
# Byte 131: Address Mapping from Edge Connector to DRAM
"Rank_1_Mapping" : 1,
"Byte_131_reserved" : 7,
# Byte 132 - 191: Reserved
"Byte_132_191_reserved" [60] : 8,
# Unused
# Byte 192 - 253: Unused
"Byte_192_255_unused" [62] : 8,
# Byte 254 - 255: CRC for SPD Block 1
"CRC_SPD_Block_1" : 16,
# Reserved
# Byte 256 - 319: Reserved
"Byte_256_319_reserved" [64] : 8,
# End User Programmable
# Byte 384 - 511
"End_User_Programmable" [128] : 8
}

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#!/bin/bash
#
# This file is part of the coreboot project.
#
# This program is free software; you can redistribute it and/or modify
# it under the terms of the GNU General Public License as published by
# the Free Software Foundation; version 2 of the License.
#
# This program is distributed in the hope that it will be useful,
# but WITHOUT ANY WARRANTY; without even the implied warranty of
# MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
# GNU General Public License for more details.
#
#
# Parses spd hex files and outputs the contents in various formats
#
#
# Outputs csv, set, and json in same folder as SPD_HEX_FILE
#
# Example:
# decode_spd.sh ../../src/mainboard/google/zork/spd/micron-MT40A512M16TB-062E-J.spd.hex
#
# Outputs ../../src/mainboard/google/zork/spd/micron-MT40A512M16TB-062E-J.spd.{json|csv|set}
#
# TODO: This script assumes bincfg binary is at ../bincfg/bincfg (which is the
# result of running the bincfg make), and the specs are at
# ../bincfg/*.spec. This dependency should be made more resilliant and
# configurable.
set -e
function read8 () {
echo $(( 16#$(xxd -s "${2}" -l 1 -p "${1}") ))
}
for file in "$@"
do
bintmp=$(mktemp)
outfile="${file%.hex}.set"
echo "Decoding ${file}, outputting to ${outfile}"
grep -v '^#' "${file}" | xxd -r -p - "${bintmp}"
dram_type=$(read8 "${bintmp}" 2)
if [ ! "${dram_type}" -eq 12 ]
then
#TODO: Handle other dram types
printf "Error: Expecting dram4 (12), got %d\n" "${dram_type}"
continue
fi
revision=$(read8 "${bintmp}" 1)
if [ ! "${revision}" -eq $((0x13)) ]
then
printf "Warning: Expecting revision 0x13, got 0x%x.\n" "${revision}"
fi
module_type=$(read8 "${bintmp}" 3)
case "${module_type}" in
1) # RDIMM
spec="../bincfg/ddr4_registered_spd_512.spec"
;;
2 | 3) #UDIMM | SO-DIMM
spec="../bincfg/ddr4_unbuffered_spd_512.spec"
;;
* )
printf "Error: Unhandled module type %d.\n" "${module_type}"
;;
esac
../bincfg/bincfg -d "${spec}" "${bintmp}" "${outfile}"
grep -v '^#' "${outfile}" | sed -e 's/ = \([^,]\+\)/: "\1"/g' \
> "${file%.hex}.json"
grep -v -e '^#' -e '^{' -e '^}' "${outfile}" | sed -e 's/=/,/g' \
> "${file%.hex}.csv"
done

2
util/scripts/description.md
View File

@ -3,6 +3,8 @@ __scripts__
line `Bash`
* _cross-repo-cherrypick_ - Pull in patches from another tree from a
gerrit repository. `Shell`
* _decode_spd.sh_ - Decodes Serial Presence Detect (SPD) files into
various human readable formats.
* _dts-to-fmd.sh_ -Converts a depthcharge fmap.dts into an fmaptool
compatible .fmd format `Bash`
* _find-unused-kconfig-symbols.sh_ - Points out Kconfig variables