coreboot-kgpe-d16/util/bincfg/ddr4_unbuffered_spd_512.spec

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# 4_01_02_AnnexL-R25_SPD_for_DDR4_SDRAM_Release_3_Sep2015.pdf
#
# JEDEC Standard No. 21-C
# Page 4.1.2.12.3 1
# Annex L: Serial Presence Detect (SPD) for DDR4 SDRAM Modules
# DDR4 SPD Document Release 3
# UDIMM Revision 1.1
# RDIMM Revision 1.1
# LRDIMM Revision 1.1
# NVDIMM Revision 1.0
{
# Byte 0: Number of Bytes Used / Number of Bytes in SPD Device /
# CRC Coverage
"SPD_Bytes_Used" : 4,
"SPD_Bytes_Total" : 3,
"CRC_Coverage" : 1,
# Byte 1: SPD Revision
"SPD_Revision" : 8,
# Byte 2: Key Byte / DRAM Device Type
"DRAM_Device_Type" : 8,
# Byte 3: Key Byte / Module Type
"Base_Module_Type" : 4,
"Hybrid_Media" : 3,
"Is_Hybrid" : 1,
# Byte 4: SDRAM Density and Banks
"SDRAM_Capacity" : 4,
"Bank_Address_Bits" : 2,
"Bank_Group_Bits" : 2,
# Byte 5: SDRAM Addressing
"Column_Address_Bits" : 3,
"Row_Address_Bits" : 3,
"Byte_5_reserved" : 2,
# Byte 6: SDRAM Package Type
"Signal_Loading" : 2,
"Byte_6_reserved" : 2,
"Die_Count" : 3,
"SDRAM_Package_Type" : 1,
# Byte 7: SDRAM Optional Features
"Maximum_Activate_Count" : 4,
"Maximum_Activate_Window" : 2,
"Byte_7_reserved" : 2,
# Byte 8: SDRAM Thermal and Refresh Options
"Byte_8_reserved" : 8,
# Byte 9: Other SDRAM Optional Features
"Byte_9_reserved" : 5,
"Soft_PPR" : 1,
"Post_Package_Repair" : 2,
# Byte 10: Secondary SDRAM Package Type
"Secondary_Signal_Loading" : 2,
"Secondary_DRAM_Densityt_Ratio" : 2,
"Secondary_Die_Count" : 3,
"Secondary_SDRAM_Package_Type" : 1,
# Byte 11: Module Nominal Voltage, VDD
"DRAM_VDD_1_2_V" : 2,
"Byte_11_reserved" : 6,
# Byte 12: Module Organization
"SDRAM_Device_Width" : 3,
"Number_of_Package_Ranks_per_DIMM" : 3,
"Rank_Mix" : 1,
"Byte_12_reserved" : 1,
# Byte 13: Module Memory Bus Width
"Primary_bus_width_in_bits" : 3,
"Bus_width_extension_in_bits" : 2,
"Byte_13_reserved" : 3,
# Byte 14: Module Thermal Sensor
"Byte_14_reserved" : 7,
"Thermal_Sensor" : 1,
# Byte 15: Extended Module Type
"Extended_Base_Module_Type" : 4,
"Byte_15_reserved" : 4,
# Byte 16: Reserved
"Byte_16_reserved" : 8,
# Byte 17: Timebases
"Fine_Timebase" : 2,
"Medium_Timebase" : 2,
"Byte_17_reserved" : 4,
# Byte 18: SDRAM Minimum Cycle Time (tCKAVGmin)
"tCKAVGmin" : 8,
# Byte 19: SDRAM Maximum Cycle Time (tCKAVGmax)
"tCKAVGmax" : 8,
# Bytes 20 - 23: CAS Latencies Supported
"CL_7_Supported" : 1,
"CL_8_Supported" : 1,
"CL_9_Supported" : 1,
"CL_10_Supported" : 1,
"CL_11_Supported" : 1,
"CL_12_Supported" : 1,
"CL_13_Supported" : 1,
"CL_14_Supported" : 1,
"CL_15_Supported" : 1,
"CL_16_Supported" : 1,
"CL_17_Supported" : 1,
"CL_18_Supported" : 1,
"CL_19_Supported" : 1,
"CL_20_Supported" : 1,
"CL_21_Supported" : 1,
"CL_22_Supported" : 1,
"CL_23_Supported" : 1,
"CL_24_Supported" : 1,
"CL_25_Supported" : 1,
"CL_26_Supported" : 1,
"CL_27_Supported" : 1,
"CL_28_Supported" : 1,
"CL_29_Supported" : 1,
"CL_30_Supported" : 1,
"CL_31_Supported" : 1,
"CL_32_Supported" : 1,
"CL_33_Supported" : 1,
"CL_34_Supported" : 1,
"CL_35_Supported" : 1,
"CL_36_Supported" : 1,
"Byte_23_reserved" : 1,
"CL_range" : 1,
# Byte 24: Minimum CAS Latency Time (tAAmin)
"tAAmin" : 8,
# Byte 25: Minimum RAS to CAS Delay Time (tRCDmin)
"tRCDmin" : 8,
# Byte 26: Minimum Row Precharge Delay Time (tRPmin)
"tRPmin" : 8,
# Bytes 27 - 29: Minimum Active to Precharge Delay Time (tRASmin)
# / Minimum Active to Active/Refresh Delay Time
# (tRCmin)
"tRASmin_MSN" : 4,
"tRCmin_MSN" : 4,
"tRASmin_LSB" : 8,
"tRCmin_LSB" : 8,
# Bytes 30 - 31: Minimum Refresh Recovery Delay Time (tRFC1min)
"tRFC1min_LSB" : 8,
"tRFC1min_MSB" : 8,
# Bytes 32 - 33: Minimum Refresh Recovery Delay Time (tRFC2min)
"tRFC2min_LSB" : 8,
"tRFC2min_MSB" : 8,
# Bytes 34 - 35: Minimum Refresh Recovery Delay Time (tRFC4min)
"tRFC4min_LSB" : 8,
"tRFC4min_MSB" : 8,
# Byte 36 - 37: Minimum Four Activate Window Delay Time
# (tFAWmin)
"tFAWmin_MSN" : 4,
"Byte_36_reserved" : 4,
"tFAWmin_LSB" : 8,
# Bytes 38: Minimum Activate to Activate Delay Time (tRRD_Smin),
# different bank group
"tRRD_Smin" : 8,
# Byte 39: Minimum Activate to Activate Delay Time (tRRD_Lmin),
# same bank group
"tRRD_Lmin" : 8,
# Byte 40: Minimum CAS to CAS Delay Time (tCCD_Lmin), same bank
# group
"tCCD_Lmin" : 8,
# Byte 41 - 42: Minimum Write Recovery Time (tWRmin)
"tWRmin_MSN" : 4,
"Byte_41_reserved" : 4,
"tWRmin_MSB" : 8,
# Byte 43-45: Minimum Write to Read Time (tWTR_Smin),
# different bank group / Minimum Write to Read Time
# (tWTR_Lmin), same bank group
"tWTR_Smin_MSN" : 4,
"tWTR_Lmin_MSN" : 4,
"tWTR_Smin_LSB" : 8,
"tWTR_Lmin_LSB" : 8,
# Byte 46~59: Reserved, Base Configuration Section
"Byte_46_59_reserved" [14] : 8,
# Byte 60: Connector to SDRAM Bit Mapping (DQ0-3)
"DQ0_3" : 8,
# Byte 61: Connector to SDRAM Bit Mapping (DQ4-7)
"DQ4_7" : 8,
# Byte 62: Connector to SDRAM Bit Mapping (DQ8-11)
"DQ8_11" : 8,
# Byte 63: Connector to SDRAM Bit Mapping (DQ12-15)
"DQ12_15" : 8,
# Byte 64: Connector to SDRAM Bit Mapping (DQ16-19)
"DQ16_19" : 8,
# Byte 65: Connector to SDRAM Bit Mapping (DQ20-23)
"DQ20_23" : 8,
# Byte 66: Connector to SDRAM Bit Mapping (DQ24-27)
"DQ24_27" : 8,
# Byte 67: Connector to SDRAM Bit Mapping (DQ28-31)
"DQ28_31" : 8,
# Byte 68: Connector to SDRAM Bit Mapping (CB0-3)
"CB0_3" : 8,
# Byte 69: Connector to SDRAM Bit Mapping (CB4-7)
"CB4_7" : 8,
# Byte 70: Connector to SDRAM Bit Mapping (DQ32-35)
"DQ32_35" : 8,
# Byte 71: Connector to SDRAM Bit Mapping (DQ36-39)
"DQ36_39" : 8,
# Byte 72: Connector to SDRAM Bit Mapping (DQ40-43)
"DQ40_43" : 8,
# Byte 73: Connector to SDRAM Bit Mapping (DQ44-47)
"DQ44_47" : 8,
# Byte 74: Connector to SDRAM Bit Mapping (DQ48-51)
"DQ48_51" : 8,
# Byte 75: Connector to SDRAM Bit Mapping (DQ52-55)
"DQ52_55" : 8,
# Byte 76: Connector to SDRAM Bit Mapping (DQ56-59)
"DQ56_59" : 8,
# Byte 77: Connector to SDRAM Bit Mapping (DQ60-63)
"DQ60_63" : 8,
# Bytes 78~116: Reserved, Base Configuration Section
# Must be coded as 0x00
"Byte_78_116_reserved" [39] : 8,
# Byte 117: Fine Offset for Minimum CAS to CAS Delay Time
# (tCCD_Lmin), same bank group
"tCCD_Lmin_Fine_Offset" : 8,
# Byte 118: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Lmin), same bank group
"tRRD_Lmin_Fine_Offset" : 8,
# Byte 119: Fine Offset for Minimum Activate to Activate Delay
# Time (tRRD_Smin), different bank group
"tRRD_Smin_Fine_Offset" : 8,
# Byte 120: Fine Offset for Minimum Active to Active/Refresh
# Delay Time (tRCmin)
"tRCmin_Fine_Offset" : 8,
# Byte 121: Fine Offset for Minimum Row Precharge Delay
# Time (tRPmin)
"tRPmin_Fine_Offset" : 8,
# Byte 122: Fine Offset for Minimum RAS to CAS Delay
# Time (tRCDmin)
"tRCDmin_Fine_Offset" : 8,
# Byte 123: Fine Offset for Minimum CAS Latency Time (tAAmin)
"tAAmin_Fine_Offset" : 8,
# Byte 124: Fine Offset for SDRAM Maximum Cycle Time
# (tCKAVGmax)
"tCKAVGmax_Fine_Offset" : 8,
# Byte 125: Fine Offset for SDRAM Minimum Cycle Time
# (tCKAVGmin)
"tCKAVGmin_Fine_Offset" : 8,
# Byte 126 - 127: Cyclical Redundancy Code (CRC) for
# Base Configuration Section
"CRC_Base_Configuration" : 16,
# Standard Module Parameters - Overlay Bytes 128~191
# Module Specific Bytes for Unbuffered Memory Module Types
# Byte 128: Raw Card Extension, Module Nominal Height
"Module_Nominal_Height_Max" : 5,
"Raw_Card_Extension" : 3,
# Byte 129: Module Maximum Thickness
"Module_Maximum_Thickness_Front" : 4,
"Module_Maximum_Thickness_Back" : 4,
# Byte 130: Reference Raw Card Used
"Reference_Raw_Card" : 5,
"Reference_Raw_Card_Revision" : 2,
"Reference_Raw_Card_Extension" : 1,
# Byte 131: Address Mapping from Edge Connector to DRAM
"Rank_1_Mapping" : 1,
"Byte_131_reserved" : 7,
# Byte 132 - 191: Reserved
"Byte_132_191_reserved" [60] : 8,
# Unused
# Byte 192 - 253: Unused
"Byte_192_255_unused" [62] : 8,
# Byte 254 - 255: CRC for SPD Block 1
"CRC_SPD_Block_1" : 16,
# Reserved
# Byte 256 - 319: Reserved
"Byte_256_319_reserved" [64] : 8,
# End User Programmable
# Byte 384 - 511
"End_User_Programmable" [128] : 8
}