48 lines
1.5 KiB
Markdown
48 lines
1.5 KiB
Markdown
# Lenovo X301
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## Disassembly Instructions
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You must remove the following parts to access the SPI flash:
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* Battery pack
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* Keyboard
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Its [Hardware Maintenance Manual](https://download.lenovo.com/ibmdl/pub/pc/pccbbs/mobiles_pdf/43y9441.pdf) can be used as a guidance of disassembly.
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The WSON-8 flash chip (surrounded with red circle in the photo above,
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already replaced with a SOIC-8 one) sits under a piece of insulating
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tape. If solders between the chip and soldering pads fortunately
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overflows beside the chip as tiny tin balls attached to soldering pads,
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it will be possible to use a pomona 5250 clip to hold the chip, with
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its metal tips just attached to tin balls, thus connecting the chip to
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the programmer. Otherwise, it may be recommended to replace it with a
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SOIC-8 one (you might need to add the chip to the IFD VSCC list), as
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what is done in the photo.
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The vendor IFD VSCC list contains:
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- MACRONIX_MX25L6405 (0xc2, 0x2017)
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- WINBOND_NEX_W25X64 (0xef, 0x3017)
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- ATMEL_AT25DF641 (0x1f, 0x4800)
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The general [flashing tutorial] has more details.
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Tested:
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- Core 2 Duo U9400 CPU
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- Slotted DIMM 4GiB*2 from Samsung
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- Camera
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- PCI-e slots
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- SATA and USB2
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- libgfxinit-based graphics init
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- NVRAM options for North and South bridges
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- Sound
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- ThinkPad EC
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- S3
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- Linux 4.19.67-2 within Debian GNU/Linux stable, loaded from
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Linux payload (Heads) and SeaBIOS.
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[flashing tutorial]: ../../tutorial/flashing_firmware/ext_power.md
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