acbc03c79d
Updating from commit id c0cb4bfa: 2023-12-08 signer: sign_android_image.sh should die when image repacking fails to commit id 7c3b60bb: 2023-10-13 firmware/2lib: Use SSE2 to speed-up Montgomery multiplication This brings in 3 new commits: 7c3b60bb firmware/2lib: Use SSE2 to speed-up Montgomery multiplication 8bb2f369 firmware: 2load_kernel: Set data_key allow_hwcrypto flag 2b183b58 vboot_reference: open drive rdonly when getting details 6ee22049 sign_official_build: switch from dgst to pkeyutl da69cf46 Makefile: Add support for make 4.3 Also update the implementations of the vb2ex_hwcrypto_modexp() callback to match the API changes made in vboot. Change-Id: Ia6e535f4e49045e24ab005ccd7dcbbcf250f96ac Signed-off-by: Julius Werner <jwerner@chromium.org> Reviewed-on: https://review.coreboot.org/c/coreboot/+/79685 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: Jérémy Compostella <jeremy.compostella@intel.com> Reviewed-by: Subrata Banik <subratabanik@google.com> |
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amd | ||
cavium | ||
example/min86 | ||
intel | ||
mediatek | ||
nvidia | ||
qualcomm | ||
rockchip | ||
samsung | ||
sifive/fu540 | ||
ti | ||
ucb/riscv |