281e2c1987
This patch moves common thermal API between chipsets with thermal device as PCI device and thermal device behind PMC into common file (thermal_common.c). Introduce CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV to let SoC Kconfig to select as applicable for underlying chipset. +------------------------------------------------------+--------------+ | Thermal Kconfig | SoC | +------------------------------------------------------+--------------+ | CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_PCI_DEV | SKL/KBL, CNL | | | till ICL | +------------------------------------------------------+--------------+ | CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL_BEHIND_PMC | TGL onwards | | | ICL | +------------------------------------------------------+--------------+ Either of these two Kconfig internally selects CONFIG_SOC_INTEL_COMMON_BLOCK_THERMAL to use common thermal APIs. BUG=b:193774296 TEST=Able to build and boot hatch and adlrvp platform. Change-Id: I14df5145629ef03f358b98e824bca6a5b8ebdfc6 Signed-off-by: Subrata Banik <subrata.banik@intel.com> Reviewed-on: https://review.coreboot.org/c/coreboot/+/59509 Tested-by: build bot (Jenkins) <no-reply@coreboot.org> Reviewed-by: Angel Pons <th3fanbus@gmail.com> Reviewed-by: EricR Lai <ericr_lai@compal.corp-partner.google.com> Reviewed-by: Tim Wawrzynczak <twawrzynczak@chromium.org> |
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.. | ||
acpi | ||
bootblock | ||
include/soc | ||
romstage | ||
acpi.c | ||
chip.c | ||
chip.h | ||
cpu.c | ||
elog.c | ||
espi.c | ||
finalize.c | ||
fsp_params.c | ||
gpio.c | ||
gspi.c | ||
i2c.c | ||
Kconfig | ||
lockdown.c | ||
Makefile.inc | ||
me.c | ||
p2sb.c | ||
pmc.c | ||
pmutil.c | ||
reset.c | ||
sd.c | ||
smihandler.c | ||
spi.c | ||
systemagent.c | ||
uart.c |